任何工具. 任何规模. 任何时候.
5G is driving tremendous increases in speed, 带宽, and data throughput for mobile and automotive applications by introducing carrier aggregation, 大规模分布式天线, and increased throughput with advanced modulation and high 带宽 channels via mmWave spectrums. This is adding a great deal of complexity to baseband, 基础设施, and application processor technologies, which has created the demand for new innovative IP to address this complexity. 新濠天地’ 设计Ware® IP portfolio provides trusted solutions from high-speed 模拟前端s, to proven interface IP in advanced FinFET technologies and processing solutions to meet the demands of the most advanced 5G chipset designs.
Read the white paper to learn more: How 5G is Influencing 硅设计
Efficient and optimized processors increase work completed per cycle, reducing power
模拟前端 delivers GHz channel 带宽 support at very low power. Modular 5G AFE supports:
Available in 22-nm to 7-nm required for high-performance 5G designs
Security protocol acceleration in a trusted environment: